The Asian Development Bank – Japan Scholarship Program (ADB-JSP) provides support for Master’s degree study in ADB-JSP approved fields of study at the University of Hawai‘i at Mānoa (UHM), and for participation in the educational, residential, and leadership development programs at the East-West Center (EWC).

This scholarship opportunity aims to provide an opportunity for well-qualified citizens of ADB's developing member countries to undertake graduate studies in economics, management, science and technology, and other development-related fields at participating academic institutions in the Asian and Pacific Region. 

Application Deadline: January 4, 2023

Eligible Countries: International

Type: Postgraduate

Number Of Scholarships: Not Mentioned

Value Of Scholarship: The ADB-JSP scholarship provides the following support for Master’s degree study at the University of Hawaii at Manoa:

• Full tuition and fees,
• Roundtrip travel to Honolulu from the applicant’s home country,
• Housing in East-West Center residence facilities,
• Monthly stipend,
• Funds for textbooks,
• Health insurance,
• U.S. visa sponsorship (J-1 Exchange Visitor).

Eligibility: 

• You must be a citizen and current resident of a developing member country of the Asian Development Bank and not more than 35 years old at the time of application.
• You must have a 4-year bachelor’s degree or the equivalent of a 4-year Bachelor’s degree, at the time of application. (An equivalent could be a 3-year Bachelor’s degree plus a 1-year Master’s degree, or a 2-year bachelor’s degree plus a 2-year Master’s degree. This is subject to review.)
• You must have at least 2 years of full-time professional work experience after a university degree at the time of application.
• You must take one of the English proficiency tests; the minimum acceptable scores are 550 for the paper-based TOEFL; 213 for the computer-based TOEFL; and 79-80 for the internet-based TOEFL iBT; or 6.5 for the IELTS. Results must be taken from a test within the past two years.

Application Process: APPLY HERE

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