The Bond University is awarding scholarships to high achieving individuals who have outstanding leadership experience and community involvement with a partial-fee tuition remission scholarship.
International Leadership Scholarships are awarded on the basis of academic excellence and evidence of outstanding leadership and community achievements.
Eligible Countries: Egypt, Ghana, Kenya, Nigeria, South Africa, Cambodia, China, Hong Kong, India, Japan, Jordan, Korea, Republic of, Malaysia, Mongolia, Nepal, Oman, Pakistan, Philippines, Sri Lanka, Taiwan, Province of China, Thailand, United Arab Emirates, Viet Nam, Denmark, France, Germany, Norway, Russian Federation, Spain, Sweden, Switzerland, United Kingdom, Mexico, United States, Papua New Guinea, Argentina, Brazil, Colombia, Peru
Type: Masters & Undergraduate
Value of Scholarship: AUD$10,000 tuition remission
Number of Awards: Not Specified
Application Process: Applicants must take admission in an undergraduate degree program at Bond University. After completion of the Bond University online study application form, eligible students can apply for programmes via the application form.
The form must be completed in full and returned to firstname.lastname@example.org by the relevant application closing date.
Visit The Official Website For More Information